以硼氢化钠为还原剂化学镀镍的电化学研究-IngentaConnect.PDF

物理化学学报(Wuli Huaxue Xuebao) March Acta Phys. ⁃Chim. Sin. 2011, 27 (3), 633-640 633 [Article] 以硼氢化钠为还原剂化学镀镍的电化学研究 贾 飞 王周成* (厦门大学化学化工学院, 化学工程与生物工程系, 福建厦门361005) 摘要: 采用线性电位扫描伏安法研究了以硼氢化钠为还原剂的化学镀镍体系, 考查了镀液组成及工艺条件对 2+ - 化学镀镍硼阴、阳极过程的影响, 结果表明: 乙酸镍和硼氢化钠含量的提高分别促进了Ni 的还原反应和BH 的 4 氧化反应; 乙二胺、氢氧化钠以及添加剂硫脲、糖精钠对阴、阳极反应均有不同程度的抑制作用, 同时添加剂中 的硫元素加速了镍的氧化; 升高温度有利于阴、阳极反应的进行. 关键词: 化学镀镍; 阴极还原; 阳极氧化; 极化; 添加剂; 吸附 中图分类号: O646 Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant JIA Fei WANG Zhou-Cheng* (Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China) Abstract: We studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry. The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied. Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni2 + and the oxidation of BH -, respectively. Ethylenediamine, 4 sodium hydroxide, thio