电化学沉积掺锶透钙磷石涂层的实验研究-口腔颌面外科学专业论文.docx

电化学沉积掺锶透钙磷石涂层的实验研究-口腔颌面外科学专业论文.docx

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电化学沉积掺锶透钙磷石涂层的实验研究-口腔颌面外科学专业论文

解放军医 解放军医学院博士学位论文 万方数据 万方数据 胞,观察细胞生长情况,应用 MTT 检测细胞毒性和增殖,ALP 检测细胞活性, 并应用 RT-PCR 检测 bFGF 和 VEGF 的 mRNA 表达情况。 结果 1 通过电沉积法在钛基表面制备出均匀的掺锶透钙磷石涂层,涂层主要由 不同形态的晶体组成,主要物相为磷酸氢锶和透钙磷石; 2 通过调整不同的锶和钙摩尔比,可得到不同含锶浓度的掺锶透钙磷石涂 层。 3 锶与透钙磷石协同促进了种植体骨结合; 4 掺锶透钙磷石涂层提高了种植体骨结合率;10%掺锶透钙磷石涂层效果显 著。 5 掺锶透钙磷石涂层促进了成骨细胞 ALP 的表达; 6 掺锶透钙磷石涂层具有较好的安全性和生物相容性; 7 掺锶透钙磷石涂层上调了成骨细胞 bFGF 及 VEGF mRNA 的表达水平,从而 明显增强其对成骨细胞分化的诱导作用; 8 10%掺锶透钙磷石涂层具有较显著的促进成骨细胞生长的作用。 结论: 电化学沉积及体内外实验结果表明,电化学沉积掺锶透钙磷石涂层可以促 进成骨细胞生长,促进种植体的骨结合。为掺锶透钙磷石涂层种植体的临床应 用奠定了理论基础,具有一定的的临床应用价值。 关键词: 锶, 透钙磷石, 涂层, 种植体, 成骨细胞, 医用生物材料 2 Experimental study of strontium-doped brushite coatings by electrochemical deposition Abstract Background: Brushite has good biocompatibility, and has a faster degradation rate under physiological conditions. At the same time, low doses of strontium can promote bone formation, meanwhile inhibit bone resorption. In this study, strontium-doped brushite coatings titanium based were deposited by electrochemical deposition. We hope strontium and brushite can emerge a synergistic effect to enhance implant osseointegration efficiency, to provide a new idea for the expansion of implant denture indications and improving the success rate of dental implant. Materials and Methods: 1. Strontium-doped brushite coatings on titanium plate surface were deposited by electrochemical deposition. The coating composition was investigated by energy dispersive X-ray spectroscopy and X-ray diffraction. The surface morphologies of the coatings were studied through scanning electron microscopy. 2. Strontium-doped brushite coatings on titanium implant surface were deposited by electrochemical deposition. The implants were implanted in tibia proximal of SD rats. The osseointegration of implant with strontium-doped brushite coatings in tibiae of rats was studied 8 weeks later after implant operation. 3. A series extracted fluid were prepared from Strontium-doped brushite coatings on titanium plate. The

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