CLEANROO PROJECT 3 Evaluating baseline recipes for standard：洁净室工程3个评价标准基线的食谱.pptVIP

 Evaluating Baseline Deposition and Etch Recipes for Silicon Dioxide and Silicon Nitride using PECVD and RIE Tools Presented by Ayesha K. Denny NNIN RET GIFT Fellow Ga Tech MiRC Summer 2007 Research Objectives Verify process rates of standard recipes on deposition and etching tools. The tools utilized for deposition were: Unaxis PECVD, Plasma Therm PECVD (left chamber SiN, right chamber SiO2), and STS PECVD. Etching tools used were Plasma Therm RIE (right chamber) and the Vision Oxide (Advance Vac). Substances deposited and etched were silicon dioxide and silicon nitride. Evaluate deposition