基于LTCC技术的射频接收前端研究-电子科学与技术专业论文.docxVIP

摘要 万方数据 摘 要 低温共烧陶瓷（LTCC）技术是一种高集成度、高性能的电子封装技术，目前 在微波多芯片组件（MMCM）等领域中有着广泛的应用。基于 LTCC 技术实现的 电路系统，能够将无源器件埋置在基板内部，构成三维立体的电路结构，从而实 现整个电路系统的小型化。 本文以 Harley 结构的镜像抑制接收机方案为基础来设计射频接收前端，根据 此设计方案进行技术指标的分配和器件的选择，并通过射频接收前端的系统行为 级仿真加以验证。在进行系统无源器件的设计时，本文充分利用 LTCC 技术多层 结构的技术特点，通过 HFSS 软件进行电磁仿真，分别设计了新型多层结构的 SIR 射频带通滤波器、Wilkinson 功分器和 90°移相耦合器，从而实现了上述无源器件 的内部埋置，以达到整个系统的小型化。在有源电路的设计方面，本文通过选取 合适的芯片贴装在基板表面，并结合整个系统的电路布局，设计偏置电路的方法 来实现。基于各个电路器件，进行射频接收前端的电路布局，并通过 ADS 软件调 用各无源器件的 S 参数模型和芯片生产商提供的有源器件 S 参数文件进行系统电 磁仿真验证，从而完成整个射频接收前端的设计。 最后基于上述的设计，在学校的 LTCC 生产线上制作出 SIR 射频带通滤波器、 Wilkinson 功分器和 90°移相耦合器三个无源器件以及整个射频接收前端的样品。 关键字：低温共烧陶瓷，射频接收前端，无源器件，仿真 I  ABSTRACT 万方数据 ABSTRACT Low Temperature Co-fired Ceramic (LTCC) technology, which is widely applied in many fields such as MMCM at present, is a highly integrated, high-performance electronic packaging technology. Circuit systems will be embedded passive components within the substrate and constitute three-dimensional circuit structure based on LTCC technology, in order to achieve the miniaturization of the entire circuit system. In this thesis, the design of RF receiver front-end is based on Harley image rejection receiver. The distribution of circuit index and the selection of devices are verified by a system simulation of the RF receiver front-end. The thesis takes advantage of LTCC technical characteristics of multilayer structure, and designs some new passive components of multilayer structure, including SIR RF bandpass filter, Wilkinson power divider and 90°phase shift coupler, by electromagnetic simulation of HFSS software. The passive components embedded within the substrate achieve the miniaturization of the circuit system. The active circuit is achieved by selecting the appropriate chips mounted on the substrate surface and designing bias circuit according to the circuit layout of the whole system. The design of RF receiver front-end is completed with system electromagnetic simulation through ADS software invoking S parameter models of passiv