《单槽法制备Cu／Ni多层膜》-毕业论文.DOCVIP

PAGE 单槽法制备Cu/Ni多层膜 摘 要 本文介绍了单槽法制备金属多层膜的方法，详细说明了阶跃恒电位电沉积法制备Cu/Ni多层膜的工艺和操作过程。首先通过电沉积Cu和Ni单层膜，计算出Cu在Ni上及Ni在Cu上的沉积速率，从而确定电沉积Cu/Ni多层膜的电沉积时间，再通过电沉积时间来控制单层膜厚。实验制备了不同调制波长的Cu/Ni多层膜并研究了Cu/Ni多层膜的力学性能，以及影响镀层质量的因素。最后对所制备的Cu/Ni多层膜试样进行了硬度测量和显微组织观察。 研究结果表明：多层膜的显微硬度与调制波长有关，当调制波长大于100 nm时，显微硬度随调制波长减小而增加；当小于100 nm时，硬度随调制波长减小而降低；调制波长为100 nm时，显微硬度取得最大值，为420 HV。通过SEM对试样微观形貌观察，镀层呈周期性层状结构分布。单槽恒电位电沉积法制备的Cu/Ni多层膜具有光亮的色泽、平整的表面。通过单槽法制备Cu/Ni多层膜工艺研究，得出制备多层膜的工艺参数是: 电沉积Cu沉积电位为-0.5V，沉积速率0.87 nm/s；电沉积Ni沉积电位为-1.1V，沉积速率为2.10nm/s。 关键词：电沉积，Cu/Ni多层膜，调制波长，显微组织 Method of Single Groove Preparing Cu/Ni Multilayer Films ABSTRACT The single groove preparation method of metal multilayer films was introduced in this paper. And the technological process of potentiostatic electrodeposition for Cu/Ni multilayer films was discussed in detail. First, electrodeposited Cu and Ni film and calculated the deposition rate to determine technological process of Cu/Ni multilayer films. Then the mechanical properties of Cu/Ni multilayer films and the influence factors of the quality of coating were studied. During the preparation of Cu/Ni multilayer films, the thickness of each layer was controlled by the electrodeposition time. At last, the hardness and microstructure of Cu/Ni multilayer films were tested and observed. The results show that the hardness of multilayer films is modulation wavelength. when the modulation wavelength greater than 100 nm, the hardness of multilayer films decreases with the modulation wavelength increasing; when the modulation wavelength less than 100 nm, the result is in contrast, when the modulation wavelength is 100nm, the hardness of multilayer films obtains maximum that is 420 HV. The films appear a clearly hierarchical structure according to the SEM observation. The Cu/Ni multilayer films which are prepared by single-bath method have bright color and smooth surface. Through the preparation of Cu/Ni multilayer films by single-bath method, the technological parameters of the preparation of m