利用EBSD探讨奈米铜镀层之晶体方向性及晶粒尺寸分布.PDF

利用EBSD 探討奈米銅鍍層之晶體方向性及晶粒尺寸分布 防蝕工程　第二十三卷第二期　第111 ～ 116 頁　2009 年6 月 Journal of Chinese Corrosion Engineering, Vol. 23, No. 2, pp. 111 ~ 116 (2009) EBSD 劉光泰、陳志慶、郭瑞昭* EBSD Characterization of Twinned Copper Prepared by Pulsed Electrodeposition Guang-Tai Liou, Delphic Chen, Jui-Chao Kuo* Received 20 August 2008; received in revised form 3 February 2009; accepted 27 February 2009 研究利用脈衝電鍍法製備具高雙晶密度之奈米純銅晶粒，再藉由EBSD (Electron Back Scattering Diffraction)來做晶體方向性、晶粒尺寸分布之分析。並比較EBSD 、TEM 以及XRD 三種分析方法決定晶粒大小之優劣。由 XRD 、EBSD 以及 TEM 來決定純銅鍍層的平均晶 粒大小分別為 82.9 nm 、1.035 µm 和 0.5 ~ 1.0 µm 。銅鍍層是由生長雙晶以及具有{220}優 選取向的不規則形狀晶粒所組成，且雙晶晶界佔全部晶界的37.98% 。 關鍵字：雙晶；脈衝電鍍；EBSD ；奈米晶粒。 ABSTRACT In this work copper with high density twins was obtained by pulsed electrodeposition technique. The crystallographic parameters and the grain size of the electrodeposited copper were determined using the electron back scattering diffraction (EBSD) technique and were compared with those obtained from transmission electron microscopy (TEM) and X-ray analyses. The average grain sizes of the as-deposited Cu determined from XRD, EBSD and TEM were 82.9 nm, 1.035 µm, and 0.5 µm to 1.0 µm, respectively. There existed a {220} preferred orientation in the as-deposited Cu and the ratio of twin boundaries to total grain boundaries was 37.98%. Keywords: Twin; Pulsed electrodeposition; BSD; Nano-particle. ˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍˍ 國立成功大學材料科學與工程學系 Department of Materials Science and Engineer