光学材料抛光亚表面损伤检测和材料去除机理.PDFVIP

31 2 JOURNAL OF NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY Vol. 31 No. 2 2009 : 1001- 2486( 2009) 02- 0107- 05 X 1 1 1 1 2 斌2 王 卓 , 吴宇列 , 戴一帆 , 李圣怡 , 鲁德凤, 徐惠贝 ( 1. , 410073; 2. , 523000) : , , , , , , , , : ; 76 105nm ; : ; ; ; :TG5801692;TN244 : A Detection of Subsurface Damage and Material Removal Mechanism in Optical Polishing Process 1 1 1 1 2 2 WANG Zhuo , WU Yu- lie , DAI Y- ifan , LI Sheng- y , LU De- feng , XU Hu- iyun ( 1. College of Mechatronics Engineering and Automation, National Univ. of Defence Technology, Changsha 410073, China; 2. SAE Technologies Development Co. , Ltd. , Dongguan 523000, China) Abstract: Subsurface damage ( SSD) may still exist in polished elements, which influences laser induced damage threshold and optical performance. Therefore, SSD must be reduced and finally removed from the polished surface to improve the service performance of optical elements. Hence it is required to make the accurate detection and characterization of the polishing SSD. In the current approach, firstly, the depth of hydrolyzed layer and embedded polishing contaminants were detected with constancy chemical etch rate technique and secondary ion mass spectrography, respectively. Then, dimension of subsurface plastic scratches was measured with atomic force microscope. Furthermore, the devel