基于BGA的复杂PCB模组仿真分析-机械电子工程专业论文.docxVIP

摘要 BGA 封装已经成为高端 IC 封装的主要形式。而焊点的热-力失效问题一直是 影响电子器件可靠性的主要原因。增加散热器是大功率芯片散热的有效途径，但 螺钉预紧力的增加使得焊球的受力情况更加复杂。本文基于 Ansys 有限元软件， 针对实际的多 BGA 芯片的复杂 PCB 板模组，建模和仿真分析 PCB 板的变形和焊 球的疲劳寿命。并分析模型分别在不同因素的影响下，PCB 板的变形和焊球寿命 的变化规律。从而为提高产品的可靠性提供理论依据。主要工作如下： 1．针对实际生产中含有 47 个 BGA 芯片的 PCB 板模组，通过一定的简化， 特别是对焊球阵列采用一种“回”字形的简化方法，建立了全简化模型，使得模 型组件的仿真能够完成。 2．先通过对全简化模型的静态仿真，得到危险芯片的位置，然后在动态温度 循环条件下，对危险芯片下无铅 SAC305 焊球采用 Anand 粘塑性本构方程，仿真 分析得到 PCB 板的变形和危险焊球的应力应变响应规律。并根据 Engelmaier 方程 计算得出危险焊球的疲劳寿命。 3．分别分析模型在两种不同焊球材料，五种不同螺钉孔位置，五种不同螺钉 预紧力，五种不同铝衬底厚度，两种不同温循条件下，PCB 板的变形和焊球寿命 的变化规律。得到结论：焊球材料对 PCB 板变形的影响很小，有铅焊球的寿命是 无铅焊球寿命的 4~9 倍；螺钉孔距离芯片越近，PCB 板的变形越小，焊球寿命越 大；螺钉预紧力越大，PCB 板的变形越大，焊球寿命越小；铝衬底厚度越大，PCB 板变形越小，焊球寿命越小；温循范围为 0~100℃时，焊球寿命在 3000 cycles 以 上，温循范围为-55~125℃时，焊球寿命在 1000 cycles 以下。 关键词： BGA 螺钉预紧力 温度循环 疲劳寿命预测 Abstract BGA package has been the mainstream of adcanced IC package. Thermal failure of the solder joints is the main reason affecting the reliability of electronic devices. Radiator offers an efficient method for power chip heat-dissipation, but the increase of the screw pre-stress makes the force situation of the solder ball more complex. Based on the finite elelment software Ansys, the deformation of PCB and the fatigue life of solder ball are modeled and simulated in this paper, focusing on the actual complex PCB module with multi-BGA chips. The change law of PCB deformation and solder ball fatigue life are obtained under different factors, and theoretical foundation is provided so as to improve the product reliablity. The main contents of the paper are as follows: Focusing on the actual PCB module with 47 BGA Chip, the full-simplified model is built through some simplifying, especially the solder ball array is simiplfied by a “cycling” method. And the simulation can be processed. Firstly, the dangerous chip can be achived by simulating full-simplified model under steady environment, and then the lead free SAC305 solder ball adopte Anand viscoplasticity constitutive equations, the change law of PCB defor