电子封装微互连中的电迁移-电子学报.PDF

8 Vol. 36 No. 8 20088 ACTA ELECTRONICA SINICA Aug. 2008 尹立孟, 张新平 ( , 510640) : , , ., , . : ; ; ; ; : TN30594 : A : (2008) Electromigration in MicroInterconnections of Electronic Packaging YIN Limeng, ZHANG Xin ing ( School of Mechanical Science and Engineering , South China Univers ity of Technology , Guangzhou , Guangdong 510640, China) Abstract : Along with the increasing miniaturization and multi functionality of electronic roducts, the electromigration of mi crointerconnections has become a severe and urgent issue, and turned to be an im ortant reliability and durability concern. This a er resents a brief overview on the electromigrtion roblem in aluminum and co er alloy interconnections, and then delivers a re view on the electromigration issues in fli chi solder connection which is currently em loyed widely in mircoelectronic ackaging technology.These issues include current crowding effect, joule heating effect, olarity effect, intermetallic com ound, electromigra tion under multi loads and lifetime of electromigration. Key words: electronic ackaging; microinterconnection; solder joint; reliability; electromigration [4] , , 1 . , . ( MP3 PDA ) . , , , ( ) . ( , ) , . , [ 1~ 3] .