FPC应用结构及制程.pptVIP

Polyimide Adhesive Copper Polyimide Copper Adhesive Polyimide CVL (Coverlay) CCL (Copper Clad Laminate) CVL (Coverlay) NC Drilling 机械钻孔 D/F Lamination Exposure DES 压膜/曝光/DES D/F Lamination Exposure 压膜/曝光 Developing Etching Stripping 显影/蚀刻/剥膜 Lamination Backing 压合/烘烤 Laser Drilling 激光钻孔 Plasma 电浆除胶 Copper Plating 镀铜 AOI 自动光学检 CVL Top Bot. Stack CVL T B贴合 Cutting 裁切 Bare Flex Inspection 空板外检 D/F Lamination Exposure Develop 压膜/曝光/显影 Surface Treatment 表面处理 Silkscreen,/Silver Ink / Solder Mask Printing 印刷文字/银浆/防焊 Blanking Punching 分条/预冲 OSP 抗氧化 Accessory Stack 贴配件 E-test 空板电测 空板制造流程