基于埋置MEMS空气隙的柔性凸点结构设计与热疲劳可靠性研究-机械电子工程专业论文.docxVIP

摘 摘 要 目 目 录 – – PAGE III – 万方数据 – – IV – 万方数据 are performed based on FEM, and effects of different copper interconnect structural parameter combination on the structural stress-strain properties are investigated based ANSYS sub-model analysis method and orthogonal experimental design. Using the sta- tistical software MINITAB, multivariate quadratic nonlinear regression analysis is car- ried out on investigating the quantitative relationship between stress property of copper interconnects and interconnect structural parameters. Then, within given ranges of pa- rameters, structural parameter optimization is carried out on the regression equation by using MATLAB optimization toolbox. The results show that, among structural parameters considered, interconnection shape is the most significant influencing factor on the stress property of copper interconnections, and thickness and width appear rel- atively small effects on the property, respectively. The interconnections stress-strain properties can be improved greatly by using bending shape interconnection. Regres- sion equation obtained by multivariate regression analysis is significant and structural parameters combination corresponding to the optimal copper interconnects stress prop- erty is obtained by optimization analysis. The application of compliant bump technology with embedded MEMS air-gap is both the internal demand for the further development of WLP technology and in- evitable tendency for accomplishment of compliant packaging. Compliant bump struc- ture with embedded air-gap designed in this dissertation, thermal fatigue reliability analysis results obtained and optimization results on copper interconnection parame- ters have reference meaning and consultative value for future development of compliant WLP technology. Key words:Wafer Level Chip Scale Packaging (WLCSP); Finite Element Method; Compliant Bump; Embedded MEMS Air Gap; Thermal Fatigue Reliability. 目 录 摘 要 I Abstract II 第一章 绪论 1 1.1 微电子封装技术概述