电子封装基板材料研究进展及发展趋势.docx

电子封装基板材料研究进展及发展趋势曾小亮1蓉1于淑会1许建斌2汪正平3孙1(中国科学院深圳先进技术研究院先进材料中心 深圳 电子封装基板材料研究进展及发展趋势 曾小亮1 蓉1 于淑会1 许建斌2 汪正平3 孙 1(中国科学院深圳先进技术研究院先进材料中心 深圳 518055) 2(香港中文大学工程学院电子工程系 香港 999077) 3(香港中文大学 香港 999077) 摘 要 基板材料在电子封装中主要起到半导体芯片支撑、散热、保护、绝缘及与外电路互连的作用。随着电子 封装技术向着高频高速、多功能、高性能、小体积和高可靠性方向发展，电子封装基板材料在新一代电子封装材 料中发挥着越来越重要的作用。科学与工业界对电子封装基板材料提出了更高的要求，同时也促进了电子封装基 板材料飞速发展。文章分别针对三大类基板材料：陶瓷基板、复合材料基板和有机基板的特点、发展现状及未来 发展趋势进行了阐述。 关键词 电子封装；基板材料；陶瓷基板；复合材料基板；有机基板 中图分类号 TB 332 文献标志码 A The Research Development and Trend of Substrates in Electronic Packages ZENG Xiaoliang1 SUN Rong1 YU Shuhui1 XU Jianbin2 WONG Chingping3 1( Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China ) 2( Department of Electronic Engineering, Faculty of Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China ) 3( The Chinese University of Hong Kong, Hong Kong 999077, China ) Abstract The main functions of substrates in electronic packaging include supporting, cooling, protection of semiconductor chips, as well as insulation and electronic interconnection with external chips. With the electronic packaging developing towards high speed, multi-functionalization, high performance, good stability and small dimension, substrates play more and more important role in the field of new generation electronics packaging. Scientists and engineers have higher requirement to substrate materials, which advances their brilliant progress. In this review, the characteristic, recent progress and future development of three kinds of substrates were summerized, including ceramic, composite and organic substrates. Keywords electronic packaging; substrate materials; ceramic substrate; composite substrate; organic substrate 收稿日期：2014-07-23 基金项目：广东省引进创新科研团队计划(2011D052 )；深圳市孔雀计划团队(KYPT20121228160843692)；三维高密度基板及高性能 CPU 封装技术 研发与产业化，国家 02 专项(2011ZX02709)；深圳市电子封装材料工程实验室(深发改【2012】372 号) 作者简介：曾小亮，博士研究生，研究方向为高导热电子封装基板材料；孙蓉(通讯作者)，博士，研究员，研究方向为新一代电子封装材料及 其产业化，E-mail： HY