铜箔生產過程及銅箔简介.docVIP

铜箔简介 Copper Foil Introduction 电解铜箔的制造方法 电解铜箔是通过对浸在硫酸铜溶液中的连续 运转的电解鼓通直流电，使铜析出的方法制造。随 着鼓的旋转逐渐产生“箔”的形状，铜箔与鼓接触 面被称为“光滑面”，“光滑面”的反面被称为“粗 糙面”。从电解鼓上剥离的箔被称为“原箔”。为了 提高与基板材料的接合力，需要对原箔的粗糙面进 电解造箔工程Electroforming 电解造箔工程 Electroforming process 等。实施了以上处理后的铜箔称为“表面处理铜箔 ”。表面处理铜箔用于环氧布基板和聚酰亚胺布基板 等印刷线路板。 Production Methods for Electrodeposited Copper Foil Electrodeposited copper foil is produced by immersion in a sulfuric acid solution where copper is electrically transferred to a rotating drum .As the drum rotates, the matside figure of foil is gradually created .The side of the foil in contact with the drum is called the “shiny side”. The side exposed to the solution is coarser, and is called “Matte side” the foil removed from the drum is known as “raw Foil”. In order to increase the adherence properties of the raw foil, it is further processed to make it Coarser. Additionally the shiny side is treated discoloration proof and corrosion resistance characteristics. The processed copper foil is called “surface treated foil” which is used in paper-phonol-based and paper-epoxy based printed circuit boards. 铜 箔 的 制 造 ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 铜 箔 的 制 造 ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 裁切 分条Cutter Slitter 裁切 分条 Cutter Slitter 防锈 Anti-tarnish 粗化 Roughing 制箔工程 Electrodeposits 表面处理Treated高纯度铜High purity copper溶解装置Dissolve卷 表面处理 Treated 高纯度铜 High purity copper 溶解装置 Dissolve 卷 Roll 包装Packing 包装 Packing 检查 Inspection 铜 箔 的 特 征 ﹒﹒﹒﹒﹒﹒ 铜 箔 的 特 征 ﹒﹒﹒﹒﹒﹒﹒﹒﹒﹒ 铜箔特征 Features of copper foil 铜箔特征 铜纯度高 High copper purity of surface treated copper foil 外观出色 Excellent appearance 无切粉、无切痕 Clean copper foil without slit burrs or debris 光滑面的特征Features of drum side 光滑面的特征 Features of drum side 层压后无氧化 No oxidation frame during lamination process 焊锡润湿性佳 Good solderability 与各种阻焊剂和抗蚀剂的密着性良 Good adhesion to solder resist and etching resist 与各种处理液的润湿性良 Good wettability to process solutions 粗面特征 粗面特征 Features of matte side Features of matte side 充分注意环保 Environment-friendly co