电沉积Zn-N-iSn合金工艺研究.PDF

Zn-N-i Sn 37 Zn-N-i Sn Electrodeposition of Zn-N-i Sn Alloy 1 1 2 2 1 , , , , ( 1 , 150001; 2 , 265400) 1 1 2 2 1 WANG Z eng , AN M ao-z ong , HU Xu-ri , XU S u-min , GAO Z en-guo ( 1 Department of Applied C emistry , Harbin Institute of Tec nology, Harbin 150001, C ina; 2 Z aoyuan Jinbao Electronic Co Ltd, Z aoyuan 265400, S andong, C ina) : Zn-N-i Sn pH , , , Zn- N-i Sn : ; ; Zn-N-i Sn ; : O646. 54 : A : 1001-4381( 2006) 04-0037-04 Abstract : Electroplating Zn-Ni-Sn ternary alloy on electrolyte copper foil using alkaline salt pyro- p osp ate solution w as investigated. Effect of bat composition, pH, temperature, current density on deposit w ere discussed, an appropriate additive w as c osen, and polarization action w as studied. Bat composition and process conditions for electroplating Zn-N-i Sn ternary alloy w ere optimized. After t e plating, corrosion resistance, eat resistance and binding strengt of electrolyte copper foil w ere improved. Key words: electrolyte copper foil; electroplating; Zn-N-i Sn ternary alloy; polarization action ( PCB) Zn-Sn, Ni[ 12] , , , Zn-N-i Sn , pH [ 1- 3] , 1 , , ( K4 P2 O7 #