日本SBU商情收集.pdf

日本SBU商情收集 SBU • RCC or PP + Laser Drill • photo via •• thermothermo-settingsetting resinresin ++ LaserLaser drilldrill • ALIVH • BBIT • OthOther Laser Via Process Core substrate Second layer RCC laminating RCC laminating ConformalConformal mask formation laser drill PTH D/F ALIVH process Aramid cloth prepreg Lay-up for Lamination Laser drilling Surface ppattern formation Conductive paste plugging Lamination Surface pattern formation ALIVH Process 2 B IT process Printing conductive paste bump Piercing prepreg with ththe bbump Lamination connection with copper Surface pattern formation BBIT Process Pattern Transfer Method Plated Riser method Dielectric Resin for build-up • Resin coated copper • Liquid type thermally • Liquid type photo- curedd resiin dielectric • Film type thermally • Film type photo cured resin dielectric • Preppregg Thermally cured resin Supplier name Ink type Film type Asahi Chemical 研發中 AjinomotoAjinomoto FilmFilm TechnoTechno ○○ ○○ Taiyo Ink ○ ○ TTokkyo OhkOhka kkogyo ○○ Hitachi Chemical ○ Asahi Denka Kogyo ○ Via Formation Process • Laser drillin