02和申请材料一起寄出的cover letter改后稿.docVIP

和申请材料一起寄出的Cover Letter Annie Wang P.O. Box 8740 Beijing 100084 P.R. CHINA October 22, 2001 Dear Sir / Madam: I am applying for acceptance and financial aid in a bid to pursue a Master’s Degree in Materials Science and Engineering at your university. My intended date of enrollment is the beginning of September 2002. Enclosed hereinwith are: (1) a completed application form; (2) the application fee by way of an international money order; (3) a copy of my resume, and (4) my personal statement. The Beijing University, my alma mater, will send official transcripts of my undergraduate academic reco