IC工艺技术-光刻.pptVIP

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  • 约9.58千字
  • 约 70页
  • 2019-08-10 发布于广东
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Hitachi 8860 --- CD SEM Leitz Microscope inspect station Autoload UV inspection system 5.0 BCD 正胶工艺 Equipment SSI, SVG8800, SVG 90 Process step pre-bake/HMDS/cold plate spin (5000rpm) ---dynamic dispense ---top (bottom) side EBR(2mm) soft bake (100oC)/cold/palte Resist/spec Shipley 6112 (1.2u) 1818 (1.8u 1st metal) 6818 (2.4u 2nd metal) 6118 (2.9u Pad) 6124 (3.6u-4.5u ST) Everlight 533(1.2) Uniformity ---+ 300A Resist coating 升降机 冷板 HMDS 涂胶 热板 冷板 升降机 SVG 90 SVG 8800 5.1.1 Positive Resist (正胶) Component (成分) Resin (树

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