封装专用英语词汇.pdfVIP

常见封装形式简介 DIP = Dual Inline Package = 双列直插封装 HDIP = Dual Inline Package with Heat Sink = 带散热片的双列 直插封装 SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装 SIP = Single Inline Package = 单列直插封装 HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插 封装 SOP = Small Outline Package = 小外形封装 HSOP= Small Outline Package with Heat Sink = 带散热片的小外形封 装 eSOP= Small Outline Package with exposed thermal pad = 载体外露 于塑封体的小外形封装 SSOP= Shrink Small Outline Package = 紧缩型小外形封装 TSSOP=