数字电路与无线通信系统电磁兼容技术发展与应用.pptx

1 ;Outline;What is EMI and EMC?;;;Problems by Power/Ground Noise;Challenges in High Speed Digital Design;8;Outline;;11;;;;;Advanced Driver Assistance Systems (ADAS);;Outline;Figure of Merit for MIMO Systems - Throughput;Hybrid: OTA + Conduction;Setup for Throughput Measurement;22;23;24;25;26;CH11 RX;13.3” Notebook: CH01(1/3);13.3” Notebook: CH06(2/3);13.3” Notebook: CH11(3/3);15” Notebook: CH01(1/3);15” Notebook: CH06(2/3);15” Notebook: CH11(3/3);Setup for Antenna Port Noise;35;Platform Noise(WLAN_AUX);Surface Scan to Locate Noise Source;Current RFI Mitigation Practices;屏蔽材料對於雜訊抑制效果比較;屏蔽材料對於雜訊抑制效果比較;屏蔽材料對於雜訊抑制效果比較;屏蔽材料對於雜訊抑制效果比較;Throughput 量測;Throughput (Uplink);Throughput (Downlink);Throughput (Bidirectional);Outline;E & H Fields on Structure;Estimating RF Interference Levels in Mixed Digital/RF Designs;RFI/EMI Analysis for RF Devices;Near field Coupling Path Loss;Platform Noise is a problem today and will get worse if we do nothing;53;;Critical industrial needs for EMC;Development trends for new EMC-strategies;;58;Outline;;61;Predict system-level performance from component-level information;;;Standard methods for emission characterization of ICs;Standard methods for immunity characterization of ICs;Intra-System EMI and PCB level EMC;Pre-Layout Placement Design;Two Source Reconstruction Approaches;Horizontal and vertical magnetic near field scan of a SoC;Hierarchy Measurement and Modeling for EMC;;Outline;EMC Design Strategies;Emerging Platform Trends;EMC Challenge and Development for Future;Isotropic Radiator Concept for Noisy IC Placement;;After Components EMC Adoption;