ipc7095c新版本技术变化.docVIP

IPC -7095C Design and Assembly Process Implementation For BGAs 1 Overview With the introduction of BGA components, things had to change: ?? New design ?? New assembly process ?? New repair process ?? New inspection techniques All information in this presentation is adapted from the IPC-7095C document 2 Scope ?? Covers the challenges for implementing all types of BGA components ?? Information in document focuses on inspection, repair and reliability with BGA components 3 Purpose ?? To provide practical and useful information to users of BGA components ?? Target audience is managers, design and process engineers, operators and technicians 4 Intent ?? This document identifies many of the issues involved which will influence the implementation of a robust BGA assembly process ?? The accept/reject criteria is found in J-STD-001 and IPC-A-610 5 Applicable Documents There is a list of ??27 IPC Documents ??16 JEDEC Documents 6 Why BGA Components ?? Peripheral devices with 1.00 mm pitch have become commonplace, however these packages cannot accommodate more than 84 pins. ?? Larger pin count devices require lead pitches on 0.65 mm, 0.5 mm or 0.3 mm ?? Therefore at these pitches leads are very fragile and susceptible to damage. ?? The BGA eliminated lead and coplanarity problems 7 BGA Package Manufacturing Process 8 Infrastructure ?? Land Patterns and circuit board considerations. ?? Technology comparison 9 Conductors Between BGA Connections ?? This gets into the size of the BGA and the number of traces which can be used between the balls of the BGA component 10 Conductor Width to Pitch Relationship 11 Infrastructure ?? Assembly Equipment Impact ?? Stencil Requirements ?? Inspection Requirements ?? Test 12 Limitations and Issues ?? Visual inspection ?? Moisture sensitivity ?? Rework ?? Cost ?? Availability ?? Voids in BGA ?? Open joints ?? Head-on-Pillow phenomenon ?? Standards and their adoption ?? Reliability concerns 13 Limitations and Issues 3.5.8 Pad Cratering – defined a