jesd51-5（高清版-国外标准）.pdf

EIA/JEDEC STANDARD Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms JESD51-5 FEBRUARY 1999 ELECTRONIC INDUSTRIES ALLIANCE JEDEC Solid State Technology Association NOTICE EIA/JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the EIA General Counsel. EIA/JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. EIA/JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the EIA/JEDEC standards or publications. The information included in EIA/JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby an EIA/JEDEC standard or publication may be further processed and ultimately become an ANSI/EIA standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the