常用元器件封装尺寸大小.docVIP

封装形式图片 国际统一简称 LDCC LGA LQFP PDIP TO5 TO52 TO71 TO71 TO78 PGAPlastic PIN?Grid Array PLCC LQFP LQFP 100L TO8 TO92 TO93 T099 EBGA 680L QFP Quad? Flat?Package TQFP 100L SBGA LBGA 160L PBGA 217L Plastic Ball Grid Array SBGA 192L TSBGA 680L CLCC SC-705L SDIP SIP Single Inline?Package SO Small?Outline Package CNR CPGACeramic Pin Outline Package DIP Dual Inline??Package DIP-tabDUAL?Inline?Package with Metal Heatsink BQFP 132 C-Bend Lead CERQUAD ?Ceramic? Quad Flat Ceramic Case LAMINATE? CSP T12L Chip Scale?Package Gull wingleads SOT343 SOT523 SOT89 SOT89 Socket 603 Foster LLP