电子产品的生产与检验 8.2.1专项课件（80个） 59 PCB生產流程.pptVIP

目 录 一 、PCB定义 二 、PCB生产流程图 三 、PCB制造过程 四 、PCB生产线介绍 Post Cure Line Automatic Legend Printing Gold Finger Plating Line ENIG Line OSP Line HASL Machine Electrical Tester Puncher Routing Machine 应用电子技术专业教学资源建设 湖南铁道职业技术学院 PCB生产流程 一 、PCB定义 PCB : Printed Circuit Board PWB：Printed Wiring Board Game Printer Graphic Card Server ODM M/B PC M/B Riser Card Game M/B PCB Quick Turn Service 二 、PCB生产流程图 Copper Foil Epoxy Glass 2.Apply Inner Layer Photo Resist Epoxy Glass Photo Resist Copper Foil 三 、PCB制造过程 1.Cut to Working Panel (42”*48” → 21”*24”) 4.After Exposured UV Light Artwork Copper Foil Epoxy Glass Photo Resist Copper Foil Epoxy Glass 3.Exposure Copper Foil Epoxy Glass Photo Resist Copper Foil Epoxy Glass Photo Resist 5.Inner Layer Dry Film Developing 6.Etching (Power/Ground or Signal) Copper Foil Epoxy Glass 8.Oxide Treatment Copper Foil Epoxy Glass Brown Oxide 7.Resist Striping Copper Foil Copper Foil Inner Layer Layer 1 Layer 2 Layer 3 Layer 4 Prepreg Prepreg LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 1 LAYER 6 9.Pre-Lamination 10. Lamination PCB Back Up Board Entry Board 11.Drilling 13.Apply Outer Layer Dry Film Photo Resist 12.Black Hole / PTH 15.After Exposure 14.Outer Layer Exposure 16.Outer Layer Developing 18.Dry Film Striping 17.Pattern Platting 20. Tin Striping 19. Copper Etching 22.Solder Mask Exposure UV Light S/M A/W 21.Apply Solder Mask 24.Legend Printing R105 PAN 101 1 94V-0 23.Solder Mask Developing R105 PAN 101 1 94V-0 25.Surface Finishes (HASL, OSP….) 四 、PCB生产线介绍 Incoming/CCL Saw Lamination 6 – Spindle Drilling Machine Black Hole PTH Dry Film Laminator Automatic Exposure Machine Pattern Plating Etching Line AOI VRS Visual Inspection Automatic S/M Printing Automatic Exposure Machine