热分析,热模型的精华资料2.pdfVIP

张飞实战电子官方网站：☜点击打开 （广告勿扰100%拒绝水贴，10名疯狂工程师运营的网站，有问必答） Thermal Characterization of Packaged ® Semiconductor Devices Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction The term psi is used to distinguish these from theta thermal resistances since not all heat is actually flowing With the continuing industry trends towards smaller, faster, between the points of temperature measurement with the and higher power devices, thermal management is psis. Theyre not true thermal resistances for this reason. becoming increasingly important. After all, higher device performance can come at a price - higher temperatures and COMMON TERMINOLOGY lower reliability - if thermal considerations arent carefully weighed. • T = Die Junction Temp, °C J Not only are devices trending smaller but the boards they • TC = Package Case Temp, °C mount onto are also shrinking. Placing the units closer and •