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558 IEEE TRANSACTIONS ON POWER ELECTRONICS, VOL. 16, NO. 4, JULY 2001
AC Resistance of Planar Power Inductors and the
Quasidistributed Gap Technique
Jiankun Hu and Charles R. Sullivan, Member, IEEE
Abstract—Low-ac-resistance planar or foil-wound inductors
constructed using a quasidistributed gap comprising multiple
small gaps that approximate a distributed gap are analyzed.
Finite-element simulations are used systematically to develop a
model broadly applicable to the design of such quasidistributed
gap inductors. It is shown that a good approximation of a
distributed gap is realized if the ratio of gap pitch to spacing
between gap and conductor is less than four, or if the gap pitch
is comparable to a skin depth or smaller. Large gaps can reduce
ac resistance, but for most practical designs gap length has little
effect. A closed-form expression, which closely approximates the Fig. 1. Distributed-gap inductor: use of a low-permeability material to achieve
ac resistance factor for a wide range of designs, is developed. The low ac resistance.
methods are illustrated with an inductor for a high-ripple-current
fast-response voltage regulator module (VRM) for microprocessor decaying exponentially with depth according to standard
power delivery.
skin-effect behavior.
Index Terms—Air gaps, distributed gaps, eddy currents, fringing Although powdered iron and other more specialized mate-
effects, inductors, magnetic devices, power conversion, proximit
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