Presentation 82 - 用于电子测试和测量的毫米波器件、集成电路和封装的趋势 (1).pdfVIP

Di LIU(刘迪) 2018.3.22 是德科技，航空航天与国防行业解决方案事业部 Trends in mmWave devices, ICs packaging for electronics TM – Technology Needs – IC – Device Technology – Packaging Technology – Summary EDICON-2018 TM Technology Needs EDICON-2018 The Trends… Broadband Instrument Bandwidth 1000 frequency domain VNA and SA 2× every ~15yr ) 100 z H G ( h t d i w d n a B 10 time-domain real-time oscilloscope 2× every ~3yr 1 1960 1970 1980 1990 2000 2010 2020 Year of Introduction VNA SA RT scope FD trend TD trend EDICON-2018 Technology for Electronics Measurement 20 dB Better …than what our customers need to measure High Repeatability Broadband Frequency Coverage Robust Manufacturability High Dynamic Range High Reliability High Power Low Noise Floor Low Cost of Ownership High Fidelity / Low Distortion Mod Quality/EVM/Spurs/Harmonics Long Platform Life Low Noise