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{安全生产管理}世界半导体生产机台安全设计验收标准英文
GlobalSemiconductorSafetyServices,LLC
SEMIS2-93AProductSafetyAssessment
FinalReport
世界半导体生产机台安全设计验收标准
AppliedMaterials
ChemicalMechanicalPolishingSystem
Model:MirraTrak
CMP工艺应用材料
Preparedfor:
AppliedMaterials
3111CoronadoDrive
SantaClara,CA95054
Preparedby:
GlobalSemiconductorSafetyServices,LLC
1313GenevaDrive
Sunnyvale,CA94089
GS3JobNo.980029
GS3DocumentNo.980029F2
Client-Confidential
保密合约
TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandremendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.ThisreportssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,andtotheprehensivenessofthetests,examinationsand/orsurveysmade.
ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.
Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.
Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.
TABLEOFCONTENTS
目录
SectionPage No.
TOC \o 1-2 \t Heading 3,1,Heading 4,2 Section1.0MANAG
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