BSOB模式与BBOS模式复习进程.pptVIP

BSOB模式与BBOS模式;Bond Stick On Ball(BSOB)/Bond Ball On Stitch(BBOS)/ Tail Break;3.1) Free Air Ball (FAB 2)is aligned to the center of the bond pad on device 2.;3.2) Capillary descends and bonds ball to bond pad.;;3.4) Capillary move to programme ball offset. Ball offset can be programmed towards or away from the first bond. + ve towards 2nd bond - ve away 2nd bond ;3.5) Capillary descends and forms stitch bond on top of the ball.;3.6) Capillary moves horizontally for a scrub distance to weaken the  wire at ball neck.;3.7) Capillary rises to tail height;3.8) Capillary rises and tears the wire, as BH ascend to Fire Level.;3.9) EFO fires to form free air ball. Cycle repeats until all “Standoff Ball” are placed.;3.10) After placing all standoff balls. The machine continue to bond wires. ;Bump ball formation for BSOB/BBOS;4.0) PARAMETER DEFINITION IN STAND OFF BALL CONTROL MENU;4.4) Scrub Distance This setting controls the capillary moves horizontally with a Scrub amplitude to weaken the wire at neck. It is always away from the first bond. Range: Scrub Dist 4 ~ 12 Setting : 8 4.5) Tail Length This setting controls the length of the tail where the bondhead rises to the preset height before the wire clamp is closed. Range : Tail Length 30 ~ 40Setting : 35 ;4.6) Time Base 1/2 This setting controls the bond time applied to the standoff ball control only. Time 1 for the 1st bond and Time 2 for the 2nd bond. 4.7) Power Base 1/2 This setting controls the ultrasonic power applied to the standoff ball control only. Power 1 for the 1st bond and Time 2 for the 2nd bond. 4.8) Force Base 1/2 This setting controls the bonding force applied to the standoff ball control only. Force 1 for the 1st bond and Force 2 for the 2nd bond. ;4.9) Standby Power 1/2 This setting controls the power activated when the bonding head reach the search level, to the moment the bond head contacts the bond surf