盈聚电子制程优劣势分析-韩文0825-教学.pptVIP

LOGO SMPS ???? AI/SMT Wave Soldring H/I T/U ICT ATE 1 ASS’Y ASS’Y Test Ultrasonic B/I Test H/P Test Output Ripple ATE 2 Packing Shipment QA/OQC Pass QC QC QC QC QC A ?? ?? B ???? ?? ??? ???? ??? ICT ATE1 ASS’Y B/I H/P Ripple Test ATE 2 Packing Shipment ???? ?? ?? ?? ?? ??? ?? ? ?? ??? ??,???? ??? ??. ????? ?? ?? ??? ??,?? ??? ?? ??? ??? . ???? ?? ?? ?? ? ?? ?? 扰流波? ??，扰流波???? ???. 扰流波? ??? ??, CHIP ???? ??? ??? ???? ??? ???; ???? ?? ??? ???? ??? ?? ??? ???. ???? ??? 1025PPM?200PPM 变更? 变更? ICT??? ??? ??,????? ??? ??? ??. ????? ?????? ?????? ??? ??? ??. ICT???? ??? 80%?93% E-Cap T