红树伟业k60核心板红树伟业k60_document k60p144m100sf2.pdfVIP

Freescale Semiconductor Document Number: K60P144M100SF2 Data Sheet: Technical Data Rev. 6, 9/2011 K60P144M100SF2 K60 Sub-Family Data Sheet Supports the following: MK60DN256ZVLQ10, MK60DX256ZVLQ10, MK60DN512ZVLQ10, MK60DN256ZVMD10, MK60DX256ZVMD10, MK60DN512ZVMD10 Features • Security and integrity modules • Operating Characteristics – Hardware CRC module to support fast cyclic – Voltage range: 1.71 to 3.6 V redundancy checks – Flash write voltage range: 1.71 to 3.6 V – Hardware ran -number generator – Temperature range (ambient): -40 to 105°C – Hardware encryption supporting DES, 3DES, AES, MD5, SHA-1, and SHA-256 algorithms • Performance – 128-bit unique identification (ID) number per chip – Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per • Human-machine interface MHz – Low-power hardware touch sensor interface (TSI) – General-purpose input/output • Memories and memory interfaces – Up to 512 KB program flash memory on non- • Analog modules FlexMemory devices – Two 16-bit SAR ADCs – Up to 256 KB program flash memory on – Programmable gain amplifier (PGA) (up to x64) FlexMemory devices