groupmeeting(北京大学微电子学研究院,方东明).pptx

groupmeeting(北京大学微电子学研究院,方东明).pptx

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Group MeetingDong-Ming Fang April 18, 2008Work in the last two weeksCompleted …1Read …2Read …3Read …4Downloaded …5Conceiving …6In EnglishProper ContentsAbout 35 PagesWork in the last two weeks Completed PPT file for oral speech1.Design …2.Fabrication …3.Measured …Work in the last two weeks Thesis draft written by… Work in the last two weeks Processes Information StorageMembraneEtchingPECVD:SiO2, Si3N4, SiC Sputter: Ti, Au, Pt, Al, Cr, W, PbLPCVD: PolySi, SiO2,Si3N4Si Oxidation:HO,O2,H2OICP: Si, Ti/Al, Cr/Cu, Cr/Pt, Ti/Pt/Au, Pyrex, SiO2RIE:Si,SiO2,Si3N4, SiO2,Solutions: KOH, BHF, HF, H3PO4AdjustingBondingIon Injection:As+,P+,B+,BF2+ Diffusion: P+,B+Anode (electrostatic), Au-Si, hot 1. Silicon Microfabrication : ….. 2. MEMS Reliability: ….. 3. NSFC Requisition : …. 4. Other: Published papers of IMEWork in the last two weeks References and PPT files Exit, Fire extinguisher, Shower equipment, Eye bath systemSafetyHealth hazard, Fire hazard, Specific hazard, ReactivityMSDS600m2,Etching platform, Shelf, Reagent chemicalsEtching RoomWork in the last two weeks Safety and Operation HandbookLearn …Read …Simulate ….Future work in the next week1Passed the …2 Read references …3Simulated and analyzed …4 Design the fabrication …Work in the last weekThe main performance figures ….Output powerFrequencyrangeTuning linearityTuning sensitivityFrequency pushingFrequency pullingHarmonic rejectionWork in the last week 1. 查阅文献 2. 学习….仿真 3. …工艺制作流程 4. 进实验室….Work in the last monthWork in the last month正胶AZ P4903实验相关 甩胶烘胶 电镀 曝光显影 Work in the last month2008.4.252008.4.22…. 大概15um用…Work in the last two weeks….会议投稿1电镀…2…项目申请3…申请的准备4Work in the last two weeksTi湿法腐蚀稀释HF溶液HF 0.4mol/L,腐蚀速率:室温100nm/s,32度时200nm/sHF 2.6mol/LHNO3 2.2mol/L32度时300nm/s50:1:1 H2O:HF:HNO320:1:1H2O:HF:H2O21:1:20HF:H2O2:HNO3Work in the last two weeksAu湿法腐蚀I2 0.09mol/LKI 0.6mol/L腐蚀速率:室温8-15nm/s1:2:1 0I2:KI:H2O25g:7g:100mlBr2:KI:H2O 1:2:3HF:HAc:HNO3Work in the last two weeks国家基金对项目的要求越来越高强调学科交叉强调原创性提高交叉项目的强度和比例基础

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