BGA塑封的散热研究.pdf

摘 要 随着微电子封装出现集成化和微型化的趋势，在器件的工作过程中，由于功率器件的 工作会产生大量的热，从而器件的散热问题越来越突出，直接影响了集成电路的使用寿命 和可靠性。因此，对封装器件进行热仿真分析并寻求更加优化的设计已变得至关重要。实 际设计过程中，我们一般通过数值模拟得到芯片的最大结温和热阻的预测值。 在文中将使用有限元分析法，对 PBGA 封装的器件进行热仿真和分析。使用 ANSYS Workbench 软件进行建模和仿真，以研究空气对流系数、基板厚度、焊球尺寸和导电胶材 料属性和塑封体 EMC 材料属性等因素与芯片热阻的关系。本文得到的主要仿真结果：各 因素对芯片结点温度和热阻的影响关系曲线，可以为微电子芯片的热设计起到一定的参考 作用。 关键词： BGA封装； ANSYS；有限元分析法；热 ABSTRACT With the trend of high integration and miniaturization in microelectronic packaging, during the operation of the packaged device, heat dissipation will become more and more prominent due to the heat generatedby the power device, which directly affects the heat dissipation of the device. The service life and reliability of integrated circuits. Therefore, it has become crucial to perform thermal simulation analysis on packaged devices and seek for more optimized designs. In the actual design process, we generally obtain the predicted value of the maximum junction temperature and thermal resistance of the chip through numerical simulation. This article will use the method of finite element analysis to perform thermal simulation and analysis on a PBGA packaged device. By using ANSYS Workbench software for modeling and simulation, the effects of factors such as air convection coefficient, substrate thickness, solder ball size, and conductive adhesive material properties, and the EMC material properties of the plastic encapsulated body on the thermal resistance of the chip are discussed. The main simulation results obtained in this paper, that is, the influence of various factors on the temperature and thermal resistance of the chip junction, can provide a certain reference for the thermal design of the microelectronic chip. Keywords: BGA package, ANSYS, finite element analysis, thermal resistance