PCB印制电路板与HDI生产流程详细总体介绍英文版.pptVIP

8Ls MLB with Laser Blind Via Process INNER LAYER IMAGE(L2-L7) AOI Inspection L4-L5 L6-L7 BV PTH L 1 L 2 L 3 L 4 L 5 L 6 L 7 L 8 L2-L3 LAMINATION (L1-l8) LASER DRILLING (L1-L2,L7-L8) DRILLING (L1-L8) (MECHANICAL DRILL) PTH OUTER LAYER IMAGE ( L1,L8 ) Double Side PROCESS 8Ls MLB with Laser Blind Via Process BV LAYER 1 LAYER 2 LAYER 3 LAYER 4 LAYER 5 LAYER 6 LAYER 7 LAYER 8 PTH LASER ABLATION (L1-L2,L7-L8) INNER LAYER IMAGE ( L3 ) D/S PROCESS L3-L4 LAMINATION (L2-L4) DRILLING (L2-L4) INNER LAYER IMAGE ( L6 ) OUTER LAYER IMAGE ( L1,L8 ) L5-L6 LAMINATION (L5-L7) DRILLING (L5-L7) PTH PTH LAMIN