Flipchip工艺流程图解.pptVIP

填膠製程 Under-fill 製程與材料之限制: 1. 加強快速填膠與固化能力 2. 提昇其介面之黏著力 3. 較低的吸水率 4. 提昇低錫鉛球間距內的流動性 5. 加強可重工性(rework) Kingbond Training Course 製程名稱: 填膠烘烤 Underfill cure 製程說明: 生產設備: 填膠烤箱 檢驗設備: 將填膠後之產品,利用烤箱進行烘烤作業, 以消除內部所留之應力及固化填膠. 顯微鏡 斷層掃瞄機 SAT 製程圖例: 烘烤 檢驗重點項目: 1. 膠體Mold body 設備名稱: Kingbond Training Course 製程名稱: 雷射正印 Laser marking 生產設備: 雷射正印機 檢驗設備: 將文字/字號以雷射正印到晶片背面區域,用以辨識產品及批號追蹤等等. 設備名稱: 顯微鏡 製程圖例: 檢驗重點項目: 1. 文字內容 Content 2. 位置方向Orientation 3. 易辨讀Legibility 文字 基板/模組 製程說明: 裸晶背面 Kingbond Training Course Evaporative solder bumping process Wafer clean Evaporation of UBM through metal mask Evaporation of high Pb solder through mask Reflow to form solder ball A. B. C. D. 95Pb/Sn UBM:Cr/Cr-Cu/Cu/Au Polymide passivation Kingbond Training Course Electroplated UBM w/ solder bumping process Sputtered UBM Apply photoresist,pattern and develop Apply2nd layer of photo resist. Pattern develop. Electroplate solder Reflow solder A. B. D. E. Photoresist Aluminum TiW/Cu or Cr/Cu Electroplate thick Cu layer and Au Copper “Stud” or “mini-bump” C. Pb/Sn Strip photoresist and etch the UBM F. Kingbond Training Course 1.Metal bump 金屬凸塊-C4 process(IBM) 2. Tape-Automated bonding 捲帶接合-ACF process 3. Anisotropic conductive adhesives 異方向性導電膠 -ACP process 4.Polymer bump 高分子凸塊 - C4 process 5.Stud bump. 打線成球 - ACP process(Matsushita) Flip Chip conductive method - connect to Substrate/PCB C4: controlled collapse chip connection ACF: anisotropic conductive film ACP(ACA): anisotropic conductive Adhesive paste Kingbond Training Course Kingbond Training Course Various flip chip technologies PS: WIT ( Wire interconnect technology) TAB(Tape- automated bonding) Kingbond Training Course Various flip chip technologies Kingbond Training Course Stud Bump Flip Chip Bond Underfill Cure oven Cure oven SBB Process C4: Controlled Collapse Chip Connection Process Kingbond Training Course Reflow oven Flip chip bonder Flux cleaner Underfill dispenser Cure oven 1. Flux coating or re-printing 2. Mounting Heating C