剪切力实验标准.docxVIP

剪切力实验标准 剪切力实验标准 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determination is based on a measure of force applied to the die, the type of failure resulting from this application of force (if failure occurs) and the visual appearance of the residual die attach media and substrate/header metallization. 2. APPARATUS. The test equipment shall consist of a load-applying instrument with an accuracy o