DuPont wet process training英文版幻灯片.pptxVIP

  • 13
  • 0
  • 约小于1千字
  • 约 41页
  • 2021-12-10 发布于河北
  • 举报
Wet Process Tra;AgendaWet clean;Pre-furnace cle;Pre-furnace cle;SC1 Work Mechan;SC1 Work Mechan;Relationship of;Wafer Surface R;SC2 Work Mechan;FEOL clean chal;AgendaWet clean;EKC PER remover;EKC Post etch r;无标题;AgendaWet clean;Wet etch vs Dry;Oxide etchHydro;Oxide etch (con;Nitride etch Ty;Nitride etch (c;Nitride etch (c;Si etch - isotr;Si etch - Aniso;Si etch – Aniso;Si etch – Aniso;Silicide etchSa;Others wet etch;OXIDATION ;SPM or PIRANHA ;SPM work mechan;EKC PR Removers;BeforeAfter30 m;AgendaWet clean;Typical wet ben;Typical EKC rem;AgendaWet clean;Single Wafer Pr;Chuck Operation;SEZ

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