AEC - Q100-001 - Rev-C - Wire Bond Shear Test金球推力标准.pdf

AEC - Q100-001 - REV-C October 8, 1998 Automotive Electronics Council Component Technical Committee ATTACHMENT 1 AEC - Q100-001 REV-C WIRE BOND SHEAR TEST AEC - Q100-001 - REV-C October 8, 1998 Automotive Electronics Council Component Technical Committee Acknowledgment Any document involving a complex technology brings together experience and skills from many sources. The Automotive Electronics Counsel would especially like to recognize the following significant contributors to the development of this document: James T. Peace DaimlerChrysler Robert V. Knoell Visteon Corporation Gerald E. Servais Delphi Delco Electronics Systems - Retired Mark A. Kelly Delphi Delco Electronics Systems AEC - Q100-001 - REV-C October 8, 1998 Automotive Electronics Council Component Technical Committee Change Notification The following summary details the changes incorporated into AEC-Q100-001 Rev-C: Section 1.3.4.4, Type 4 - Die Surface Contact: Corrected wording to reflect bond shear type where the shear tool contacts the die surface, rather than the bonding surface as stated in Rev - B. Added new Section 1.3.5, Footprint : Added new definition for “footprint”; changed numbers of subsequent sections to reflect the add