1. 您所在位置：
  2. 网站首页
  3. 文档分类
  4. 报告/分析
  5. 技术指导

数字电路3d-ic调研semi conductor presentation delvecchio andhensel17.pptxVIP

  • 6
  • 0
  • 约小于1千字
  • 约 17页
  • 2022-05-23 发布于北京
  • 举报

数字电路3d-ic调研semi conductor presentation delvecchio andhensel17.pptx

    3-Dimensional IC Fabrication;Outline;What is 3D IC?;Why 3D Fabrication?;3D IC Fabrication ;3D IC Fabrication ;Completed (2 layer) IC;Benefits (Power and Bandwidth);Benefits (Cost and Material Type);Benefits Summary;Technical Challenges (Heat);Technical Challenges (Yield);Technical Challenges (Design Complexity);Technical Challenges (Wire Density);Conclusion;References ;Concepts

    您可能关注的文档

    最近下载

    文档评论（0）

    1亿VIP精品文档

    更多 >

    相关文档

    更多 >