电路板制作流程.ppt

;;;( 2 ) 多 層 板 內 層 製 作 流 程;;;Typical PCB Manufacturing Process ;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process ;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process;Typical PCB Manufacturing Process;;Lay-up Structure;1.下料裁板 Laminate Shear (Panel Size) ;3.曝光 Expose ;5.內層板顯影 Develop ;8.黑化 Oxide Treatment ;9.疊板 Lay-up ;10.壓合 Lamination;12.鍍通孔及一次電鍍 Desmear Copper Deposition;14.外層曝光 Expose (Outer-Layer);16.外層顯影 Develop;18.去乾膜 Strip Resist;20.防焊曝光 Expose;22.文字 Legend (Silk Screen);;;;此课件下载可自行编辑修改，供参考！ 感谢您的支持，我们努力做得更好！