SMT设备原理与应用.pptx

SMT设备原理与应用Principle and Application of SMT Equipment;本课程主要讲述内容，时间安排，考试安排，实验，辅导和平时考勤 SMT工艺流程和相关设备 ;SMT概述与发展趋势 4学时 summary and trend 焊膏组成与印刷的方式 4学时 solder paste composition and printing technology 印刷机原理与应用 6学时 principle and application of printer 贴片机原理与设备 12学时 principle and application of placement machines 波峰焊原理与应用 6学时 principle and application of wave soldering oven 再流炉原理与应用 6学时 principle and application of reflow soldering oven 检测设备 4学时 inspection equipment;SMT生产线参观（印刷机、再流炉） 2学时 Visiting SMT production line(printer, reflow oven) 贴片机编程原理； 2学时 Mounter (placement machines) program 贴片设计性实验。 2学时 Placement process design experiment ;期末考试：开卷，占总分60% 平时：20%（作业50%+考勤40%+特别贡献10%） 实验：20% ;联系方式：lindachuan2009@， ldc2005@ 辅导时间和地点： 地点： 时间：每周 ;SMT概述与发展趋势;Surface mount technology was developed in the 1960s and became widely used in the late 1980s. Much of the pioneering work in this technology was by IBM. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of equivalent through-hole parts. ;SMp DIALECT;Chip Resistor;MELF;chip capacitor;chip inductor;discrete semicond