半导体制造技术导论（第二版）萧宏 第6章 光刻工艺.pptxVIP

2023-07-04;集成电路工艺流程;6.1 光刻胶;光刻胶及其成份—光刻胶;光刻胶及其成份—光谱;光刻胶及其成份—光刻胶的要求;光刻胶及其成份—光刻胶参数;光刻胶及其成份—成份;Polymer (聚合物) Solid organic(有机) material Transfers designed pattern(图案) to wafer surface Changes solubility(溶解度) due to photochemical reaction(光化学反应) when exposed to UV light. Positive polymer(正胶聚合物): 酚甲醛或酚醛树脂 Negative polymer(负胶聚合物): 聚异戊二烯橡胶;Sensitizers (感光剂) Controls and/or modifies(调整) photochemical reaction(光化学反应) of PR during exposure. Positive sensitizer (正胶感光剂);Solvent (溶剂) Dissolves(溶解) polymers and sensitizers into liquid(溶液) Allow application(应用) of thin PR layers by spinning(旋涂), 0.5 ~ 3 m