80000nt10003a r2 bgalga模块返修程序应用说明.pdfVIP

2 PROCEDURE 2.1 Module preparation Select the correct size of nozzle referring to the dimensions of the module (could be that a standard type is not suitable for the module, but in most cases the r of the rework machine is able to build custom size). Put some SMT glue points between the module PCB and the metallic frame of the shield (see the rows in the picture below). Use a hot air solder to have a correct polymerisation of the glue. After the glue is hardened, unsolder the module by using the rework machine (the glue should permit to raise the module without remov