wire bonding详细学习资料.pptVIP

WIRE BOND PROCESS INTRODUCTION1. CONTENTS ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator DEFECT2. 封裝簡介晶片Die金線 Gold Wire導線架Lead fram3. Wafer GrindingDie BondingWafer Sawtoaster Wire BondingDie Surface Coating Molding Laser Mark Solder Ball Placement SingulationPacking封裝流程 Dejunk TRIM Solder Plating Solder Plating Dejunk TRIM TRIM/ FORMING BGASURFACEMOUNTPKGTHROUGHHOLE PKG4. Wire Bond 原理padleadGold wireBall Bond( 1st Bond )Wedge Bond( 2nd Bond )5. GLASSCONTAMINATIONVIBRATIONSiO2SiGOLD BALLPRESSURE