回流焊波峰焊.docVIP

回流焊波峰焊

回流焊

由于电子产品PCB板不断小型化的需要，出现了片状元件，传统的焊接方法已不能适应需要。首先在混合集成电路板组装中采用了回流焊工艺，组装焊接的元件多数为片状电容、片状电感，贴装型晶体管及二极管等。随着SMT整个技术发展日趋完善，多种贴片元件(SMC)和贴装器件(SMD)的出现，作为贴装技术一部分的回流焊工艺技术及设备也得到相应的发展，其应用日趋广泛，几乎在所有电子产品领域都已得到应用，而回流焊技术，围绕着设备的改进也经历以下发展阶段。

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1(热板及推板式热板传导回流焊:

这类回流焊炉依靠传送带或推板下的热源加热，通过热传导的方式加热基板上的元件，用于采用陶瓷(Al2O3)基板厚膜电路的单面组装，陶瓷基板上只有贴放在传送带上才能得到足够的热量，其结构简单，价格便宜。我国的一些厚膜电路厂在80年代初曾引进过此类设备。

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andspecialtoolsforemergencyresponseequipmentandfacilities.Emergencypreparednessandresponseplan1)emergencyresponse(1)Ifamajoraccidentoccurs,theprojectshouldsetupemergencyresponseteams,chairedbytheprojectmanager,headofproductionandsafetycoordinators,professionalforemanforthecrew,primarilyresponsiblefortheorderlyrescuewhenanemergencyoccursorprocessing,outsourcing,teammanagerandsupportstaff,assistingtheDeputyProjectManagerforrelatedauxiliarywork.(2)aftertheaccident,theprojectmanagerisresponsibleforfieldcommander,advancetheestablishmentofemergencyresponseteampersonnel,accountability,seriouslyinjuredofficerssentoutrescue,haveprocedurestodealwithaccidents,incidents,maximumreductionincasualtiesandpropertyloss.(3)Ifanaccidentoccurs,pressDivisioninadvanceforemergencypersonnelcleared,concentratemanpowerandmaterialandfinancialresourcestorescuetheinjured,decreaseofthemaximumloss.(4)aftertheaccidentprocessingwork(5)identifiedthecauseoftheaccidentandthepersonresponsible.(6)thewrittenreporttothesupervisorinwriting,includingthetimeandplaceoftheaccident,injury(death)personsname,sex,age,trades,injuries,injuries.(7)thedevelopmentofeffectivepreventivemeasurestopreventsuchaccidentsfromhappeningagain.(8)educationofallpersonneloftheorganization.(9)informedcriticismofthoseresponsible.(10)allpersonnelreadouttheresults,andresponsibledisposal.(11)maintenanceofemergencysupplies,mainte