沉金板阻焊半塞孔冒油问题改良.docxVIP

沉金板阻焊半塞孔冒油问题改良

常盼;邢玉伟【摘要】为了降低沉金板阻焊半塞孔冒油比例，设计试验验证总结影响沉金板阻焊半塞孔冒油的影响因素：阻焊塞孔油墨更换、重氮片更换、显影参数调整及后烘参数优化等。通过试验逐一验证后输出控制措施从而达到改善沉金板阻焊半塞孔冒油问题。%Inordertoreducetheheavygoldplateresistanceweldingofhalfjackoilratio,wemadedesigntest,summarizedtheinfluencefactorsofoilinplughole:plugholesolderresistinkchange,diazoreplacement,imagingparametersadjustmentanddryingparameteroptimization,etc.Onebyonethroughthetestoutputcontrolmeasuressoastoachieveimprovedafterheavygoldpl-ateresistanceweldinghalfjacktakethepurposeoftheoilproblem.

【期刊名称】《印制电路信