sic mosfet-栅极驱动器共封装meeting slides.pptx

SiCMOSFET-GateDriverCo-Package

SuxuanGuo,YangLei,LiqiZhang

Feb19,2015

OutlineProgressSolvetheinaccuratethermalmeasurementwithgelontop/baredieMeasurethethermalperformanceunderthreeconditions:baredie,withheatsink,withheatsinkfanDesignandsimulatethecontinuoustestbedforevaluationFutureplan

ThermalTestMethodThermaltestmethodShortGateandSourceofbothdevicesPowerlossonthemodule:

ProblemwithgelonthermaltestBaremoduletestTestingbaremodulewithgelontopProblem:Thegelontopmessupthethermalmeasurement,thermaldistributionisunclear

ProblemwithoutcoatingBaremoduletestTestingbaremodulewithoutcoatingProblem:Duetothereflectionofcopper,thethermalmeasurementisinaccurate

ThermalTestswithcoatingModulewithblackdielectriccoatingInordertoavoidthereflection,ablackdielectriccoatingissprayedontopofthemoduleComparedwiththepreviousresults,themeasurementismoreaccurate

ThermalTestResultsThermaltestchartCurrent(A)Power(W)TestConditions0.51.8Case1/2/314Case1/2/31.56.5Case2/329Case2/32.511.5Case2/3314.7Case33.517.5Case3420.4Case34.523.9Case3527Case35.530.3Case3Case1:baremodulewithcoatingCase3:modulewithheatsinkfanCase2:modulewithheatsink

BareModuleThermalTestsBaremoduletestCurrent(A)Power(W)Temp(celsius)0.51hermalresistance:

ModuleThermalTestwithHeatSinkModulewithheatsinkCurrent(A)Power(W)Temp(celsius)0.5156511.5100Heatsinkdimension:58mm*58mm*30mm

ModulewithheatsinkThermalresistance:ModuleThermalTestwithHeatSink

ThermalTestwithHeatSinkandFanModulewithheatsinkfanCurrent(A)Power(W)Temp(celsius)0.5156511.554314.7623.517.570420.4784.523.9935271015.530.3112

Modulewithheatsinkfan1WfanaddedwithheatsinkThermalTestwithHeatSinkandFan

ThermalTestsComparisonModulewithheatsinkfanThermalresistancewithheatsinkandfan:15Wpower