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VibrationandNoiseDesignof
AdvancedTechnologyFacilitiesAhmadBayat,P.E.J.ByronDavisVibro-AcousticConsultants29June20041
VibrationandNoiseDesignofAdvancedTechnologyFacilitiesBriefbackgroundonVACCVibrationDesignofFacilitiesProblemDefinitionTwoDesignFundamentalsNoiseDesignofFacilitiesToolHook-UpStructuralEvaluation2
BackgroundonVACCOurbackground3
WesternU.S.:IntelFabsLCE,C6,11,12,22,23;SandiaNat’lLabs;HPFortCollins;MotorolaCOM1,MOS12,andFlatPanel;MicronLehi,Boise,andMaskShop;Atmel;Vitesse;PhilipsFab25;Microchip(Phoenix);NCRProjects–UnitedStatesTexas:Atmel;MotorolaULSI/MOS13;TIDMOS5,DMOS6,KilbyCenter;AMDFab25;Samsung;MethodistHeartCenter(Lubbock)EastCoast:IBM(Burlington,EastFishkill);DominionSemiconductor;Lucent(Orlando);Seagate(Pitts.);Nat’lSecurityAgency(Ft.Meade)4
California:IntelFabsD2,SC1,SC2,andIMO;StanfordUniversity;AMATBldg.s2,3,92,ArquesCenter,ScottCampus;IBMSanJose;IDT;LAMResearch;Vishay/Siliconix;NationalSemiconductor;LinearTechnology;ATT;UCCampusesatBerkeley,Davis,andSanFrancisco;LawrenceBerkeleyNationalLabs;LawrenceLivermoreNat’lLabs/NationalIgnitionFacility;Projects–USWestCoastPacificNorthwest:IntelFabsD1B,D1C,RB1,15,andPathfinder;Hyundai;WaferTechCamus;FujitsuGresham;LSILogic;IDTMASCA;Maxim;SeattleFerryTerminal;UniversityofWashingtonCalPolySanLuisObispo;InternationalRectifier;UCIrvine;STMicroelectronics5
LocalEnvironmentalSources?Larger(Heavier)AMHSsProjects–UnitedStatesManufacturingNewerGenerations?LargerSubstratesProblemDefinition:SensitivitiesProblemDefinition:Structures–FPD1,000min/secVibrationandNoiseDesignof
AdvancedTechnologyFacilitiesVibrationDesignofAdvancedTechnologyFacilitiesStructuralisolationbreaks(SIBs)Malaysia:WTM/SilterraProjects–SoutheastAsiaTaiwan,R.O.C.:TSMCFabs3,6,and7;WaferTech;QuantaTFT;Arima;Fo
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