封装基板无引线镀金工艺的金渗镀分析与改善.pdfVIP

HDI板HighDensityInterconnectorBoard印制电路信息2025No.5

封装基板无引线镀金工艺的金渗镀

分析与改善

肖挺赵增源吴剑秋朱占健

（深圳广芯封装基板有限公司，广东深圳518101）

摘要封装基板无引线镀金工艺可满足高密度微细化的布线需求，但其软金渗镀不良率高达10%，显著影响

产品生产成本。渗镀一般分布在化学镀铜层已被去除区域的镀金线路之间，原因是有微量铜残留。通过工作机理和流

程图分析，确定影响铜残留的8个因子；采用单因素实验分析和试验设计（DOE）验证，明确关键因子为板材类型、

烘干温度和微蚀量；板材因子即板材粗糙度存在差异，粗糙度越大则更易残留化学镀铜层；烘干温度影响化学镀铜层

结晶重排，使其更稳定不易被咬蚀；微蚀量波动影响化学镀铜层去除。因此，优化板材类型、烘干温度和微蚀量3个

关键因子，可降低软金渗镀导致的不良率。研究结果可为无引线镀金工艺封装基板加工异常处理提供技术参考。

关键词无引线镀金；渗镀；化学镀铜；烘干温度；微蚀

中图分类号：TN41文献标志码：A文章编号：1009⁃0096（2025）05⁃0050⁃04

Analysisandimprovementofgoldinfiltrationonnogold-

platedleadsprocesssubstrate

XIAOTingZHAOZengyuanWUJianqiuZHUZhanjian

(GreatechSubstrates(Shenzhen)Co.,Ltd.,Shenzhen518101,Guangdong,China)

AbstractTheprocessingtechnologyofBusslessSubstratehasbeenbuildedup,whichhassolvedthedemand

forhigh-densityandfinewiring.However,thedefectiverateofsoft-goldinfiltrationisupto10%,whichaffects

productdeliveryandincreasesscrapcosts.Soft-goldinfiltrationisusuallydistributedbetweenthegoldplatedlinesin

theareaswheretheelectrolesscopperlayerhasbeenremoved,andtheanalysisshowsthatthereasonistracecopper

residue.Ourteamidentifiedatotalof8factorsthataffectcopperresiduethroughmechanismanalysisanddetailed

flowchartanalysis.ThroughsinglefactorexperimentalanalysisandDOEexperimentaldesign,weidentifiedthekey

factorsasplatetype,dryingtemperature,andmicrocorrosionamount.Themaindifferenceinboardtypeisthe

roughnessoftheboard,andthelargertheroughness,themorelikelyitistol