YST 1722-2025 覆铜陶瓷基板用无氧铜带标准立项发展报告.docxVIP

覆铜陶瓷基板用无氧铜带标准立项发展报告

StandardizationDevelopmentReport:Oxygen-FreeCopperStripforCopper-CladCeramicSubstrates

摘要

关键词：覆铜陶瓷基板；无氧铜带；有色金属行业标准；功率半导体；产品标准化；YS/T1722-2025

Abstract

Withtherapiddevelopmentofpowersemiconductordevicestowardhighpowerdensity,highreliability,andminiaturization,copper-cladceramicsubstrates,asthecoreheatdissipationandinterconnectionmaterialsinpowermodulepackaging,haveincreasinglystringentperformancerequirements.Oxygen-freecopperstrip,asthekeyrawmaterialforcopper-cladceramicsubstrates,directlyaffectsthethermalconductiv