集成电路 课件Unit6 IC packaging :Beyond the shell.pptx

集成电路 课件Unit6 IC packaging :Beyond the shell.pptx

6;;;Settingthescene;Settingthescene;ScanthecodeandcompletethetechnicalvocabularyexerciseonUcampus.

;sawn.锯

laserbeamn.激光束

leadframen.引线框架

wirebondingn.引线接合

flip-chipbondingn.倒装焊接

sealvt.(为防止空气、水等渗入或渗出)把……封住

robusta.结实的;WhatarethekeyproceduresinvolvedinICpackagi

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